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Today on Design And Reuse
Rambus Reports Second Quarter 2026 Financial Results
- July 30, 2026
Korea secures partnership with AMD to advance domestic AI infrastructure
- July 30, 2026
Global semiconductor market tops $1.5 trillion for the first time, full interpretation of SIA's latest report
- July 30, 2026
Cadence Reports Second Quarter 2026 Financial Results
- July 30, 2026
The Performance Boost for AI: Quantum Computing-Based Methods Make Training of Large Data Models More Efficient
- July 30, 2026
PQSecure and QuickLogic Demonstrate Reprogrammable Post-Quantum Security for Next-Generation SoCs
- July 30, 2026
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- September 10
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, 2026
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- September 15
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- April 23
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, 2026
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- December 2
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-3
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, 2025
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Business
Rambus Reports Second Quarter 2026 Financial Results
- July 30, 2026
Korea secures partnership with AMD to advance domestic AI infrastructure
- July 30, 2026
Cadence Reports Second Quarter 2026 Financial Results
- July 30, 2026
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Security
PQSecure and QuickLogic Demonstrate Reprogrammable Post-Quantum Security for Next-Generation SoCs
- July 30, 2026
Post-Quantum Cryptography Incorporated into SoCs via eFPGA
- July 27, 2026
ELECTRA IC Unveils Comprehensive IP Core Suite for Next-Generation Post-Quantum Cryptography
- July 23, 2026
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Foundry
Keysight Certifies Electromagnetic Design Software for Intel Foundry’s Latest Processes
- July 30, 2026
Siemens’ IC design solutions now certified for Intel 14A and Intel 18A-P process technologies
- July 30, 2026
GlobalFoundries signs letter of intent with the U.S. Department of Commerce for a $300 million award to accelerate U.S. silicon photonics leadership
- July 30, 2026
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Artificial Intelligence
BrainChip AKD1500 Now Available in Compact M.2 Form Factor, Enabling Fanless Edge AI in Industrial and Commercial Designs
- July 29, 2026
Synopsys Showcases Comprehensive Autonomous Engineering Workflows from Silicon to Systems, Developed with NVIDIA Technology
- July 27, 2026
Agnisys unveils IDS-AI agentic framework and NoC automation at DAC 2026
- July 23, 2026
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Design Platform and Service
Synopsys and Intel Foundry Fast-Track Customer Readiness from Silicon to Systems on Intel 14A
- July 28, 2026
Synopsys Advances Agentic AI Chip Design with AMD and Microsoft
- July 28, 2026
Silvaco to Accelerate Physics-Based Digital Twins for Semiconductor Design and Manufacturing Using NVIDIA AI and Accelerated Computing
- July 27, 2026
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Processor
Andes Technology and Mirabilis Design Announce Collaboration on System-Level Models for Andes RISC-V Processor IP
- July 28, 2026
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Design IP
IP Cores, Inc. Releases LZR4D Terabit-Class Ultralow-Latency Single-Engine LZ4 Decompressor Core
- July 28, 2026
TES Electronic Solutions Introduces an Over-Voltage Lockout IP for the Protection of Battery-Powered Systems in X-FAB's XT018 – 0.18µm BCD-on-SOI Technology
- July 23, 2026
CAST Enhances Serial Memory Controller IP with Encryption, Low-Power, and ASIL-Ready Options
- July 21, 2026
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Internet of Things
How Industrial IoT Is Transforming Semiconductor Manufacturing
- July 27, 2026
Choosing Between RTOS and Bare-Metal for Edge IoT Devices: A Guide from SignOff Semiconductors
- July 13, 2026
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RISC-V
RISC-V Market Size To Exceed $25.07 Billion By 2035
- July 27, 2026
Charting RISC-V’s Future in HPC
- July 27, 2026
RISC-V Europe Summit 2026: Beyond Embedded Electronics
- July 23, 2026
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eFPGA / FPGA
Menta Contributes to the Successful Completion of the European Processor Initiative and Confirms its Role in Shaping Future Computing Architectures
- July 23, 2026
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Networking
Keysight and Sateliot Selected by European Space Agency to Develop Blockchain‑Enabled Framework for 5G Non‑Terrestrial Networks
- July 20, 2026
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Chiplet / Multi-Die
China Develops Its First 3.5D "Infinity Chiplet" & 3D DRAM Tech As It Tackles External HBM Constraints Through Domestic AI Supply Chain
- July 16, 2026
Socionext Addresses Datacenter Infrastructure Customer Demands for Advanced SoCs on TSMC A14 Technology
- July 6, 2026
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NewTech
Photonics projects shine a light on Europe’s future innovation
- July 13, 2026
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Automotive
CAST Expands Functional Safety IP Line with ASIL B Ready SENT/SAE J2716 Receiver Core
- July 9, 2026
In the AI-native era, what exactly are autonomous vehicles competing on?
- July 6, 2026
Imec extends auto chiplet program to edge computing
- July 6, 2026
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Audio / Video
TAKUMI starts licensing new Warping IPs "TW270" and "TW290"
- July 8, 2026
Chips&Media to Supply APV IP for Future Google Smartphones
- July 6, 2026
VeriSilicon Introduces CPP2000 Camera Post-Processing IP for Embodied Robotics and Mobile Vision Applications
- July 6, 2026
D&R Events
IP-SoC China 26
- September 10
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, 2026
Registration Open >>
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- September 15
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, 2026
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- April 23
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, 2026
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IP-SoC EU 25
- December 2
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-3
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, 2025
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