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Today on Design And Reuse
MosChip Collaborates with EMASS on Silicon Implementation for its Breakthrough Edge AI SoC
- December 4, 2025
DCD-SEMI Unveils Ultra-Fast DAES IP Core for AES Encryption
- December 4, 2025
Germany Redirects Intel Funds Into New Wave of Semiconductor Projects
- December 4, 2025
Could an EU Chips Act 2.0 Bridge the Lab-to-Fab Gap?
- December 4, 2025
BOS Semiconductors at 2025 Korea Tech Festival
- December 4, 2025
Fraunhofer HHI advances indium phosphide photonics for high-speed data communication
- December 4, 2025
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Business
MosChip Collaborates with EMASS on Silicon Implementation for its Breakthrough Edge AI SoC
- December 4, 2025
Germany Redirects Intel Funds Into New Wave of Semiconductor Projects
- December 4, 2025
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- December 4, 2025
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Design IP
DCD-SEMI Unveils Ultra-Fast DAES IP Core for AES Encryption
- December 4, 2025
VeriSilicon’s NPU IP VIP9000NanoOi-FS has achieved ISO 26262 ASIL B certification
- December 4, 2025
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Artificial Intelligence
The AI Future is Now All About the Edge
- December 4, 2025
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- December 2, 2025
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- November 28, 2025
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Design Platform
Certus Semiconductor adopts AI-powered Solido to accelerate IO library, analog IP and ESD development
- December 4, 2025
Synopsys Demonstrates Framework for Optimizing Manufacturing Processes with Digital Twins at Microsoft Ignite
- November 27, 2025
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- November 20, 2025
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Chiplet / Multi-Die
Open Chiplet Design Moves Forward with Tenstorrent’s OCA Plan
- December 4, 2025
InPsytech showcases 3nm UCIe 3.0 at OCP 2025, accelerating innovation in chiplet ecosystem
- November 27, 2025
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Embedded Processing
From Launch to Leadership: The Microservice Store Nominated for TechWorks Cybersecurity Award
- December 4, 2025
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Automotive
Arteris Selected by Black Sesame Technologies for Next Generation of Intelligent Driving Silicon
- December 2, 2025
SAICEC Partners with Siemens to Accelerate Chip-to-vehicle Validation
- December 1, 2025
BOS Semiconductors Eyes Expansion into ‘Intelligent Space’ AI Market Beyond ADAS
- November 27, 2025
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Foundry
Intel Could Manufacture Apple M-Series Chips in 2027 with 18A-P Node
- November 28, 2025
RPI and GlobalFoundries Partner on Semiconductor Research, Education, and Workforce Development Initiatives
- November 27, 2025
TSMC to Build Three New 2 nm Fabs in Taiwan for $28 Billion
- November 27, 2025
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RISC-V
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- November 27, 2025
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- November 27, 2025
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- November 24, 2025
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Green Electronics
Sustainability moves upstream delivering greener semiconductor design
- November 27, 2025
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- November 27, 2025
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- November 24, 2025
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Internet of Things
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- November 27, 2025
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Security
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FDSOI
GlobalFoundries Acquires Advanced Micro Foundry, Accelerating Silicon Photonics Global Leadership and Expanding AI Infrastructure Portfolio
- November 20, 2025
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eFPGA
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- November 19, 2025
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