Company
design-reuse.com
D&R China
Blogs
Industry Articles
D&R Events
IP-SoC Days 2025
IP-SoC Days 2024
IP-SoC Days 2023
IP-SoC Days 2022
IP-SoC Days 2021
IP-SoC 2024
IP-SoC 2023
IP-SoC 2022
IP-SoC 2021
Subscribe to D&R SoC News Alert
English
Mandarin
Register
Login
Menu
Home
Search IP Core
News
Blogs
Articles
D&R Events
Subscribe to D&R SoC News Alert
Register
Login
News
Center
Foundation IP
Analog IP
Interface IP
Interconnect IP
Memory Controller
Peripheral Controller
Wireless IP
Wireline IP
Processor IP
RISC-V
AI Core
Automotive IP
Security IP
IoT
Media IP
Avionics / Space IP
Verification IP
Verification Platform
Asic & IP Design Center
IP-SoC Days
IP-SoC Days 2025
IP-SoC Days 2024
IP-SoC Days 2023
IP-SoC Days 2022
IP-SoC Days 2021
IP-SoC 2024
IP-SoC 2023
IP-SoC 2022
IP-SoC 2021
Partner Highlight
New Products
Soft IP - The Only eFPGA Soft IP
PVT Sensor(SF 4nm, LN04LPP)
PCIe Controller IP
Specialized video processing NPU for SR, NR, Demosaic New!
MCU Platform for Industrial Applications
Blogs
Enabling Chiplet Design Through Automation and Integration Solutions
Andy Nightingale
Arteris IP
How to design secure SoCs Part IV: Runtime Integrity Protection
KiviCore
From I2C to I3C: Evolution of Two-Wire Communication in Embedded Systems
Piotr Koziuk
Chip Interfaces ApS
Cadence Welcomes VLAB Works
Cadence Design Systems, Inc.
Cadence Launches Cache-Coherent HiFi 5s SMP for Next-Gen Audio Applications
Cadence Design Systems, Inc.
Why Hardware Security Is Just as Critical as Software Security in Modern Systems
Vincent van der Leest, Mike Borza
Synopsys, Inc.
How Arasan's SoundWire PHY Can Elevate Your Next Audio SoC
Arasan Chip Systems Inc.
PCIe 6.x and 112 Gbps Ethernet: Synopsys and TeraSignal Achieve Optical Interconnect Breakthroughs
Magaly Sandoval-Pichardo
Synopsys, Inc.
BLACKBOX AI: Dissecting the AI Network Traffic
Sulagna Adhikary, R&D
Keysight Technologies
Powering the Future of RF: Falcomm and GlobalFoundries at IMS 2025
GlobalFoundries
Synopsys Expands Collaboration with Arm to Accelerate the Automotive Industry's Transformation to Software-Defined Vehicles
Synopsys, Inc.
Arm Zena CSS - Accelerating Chiplet-Based SoC Design for AI-Defined Vehicles
Cadence Design Systems, Inc.
Articles
RISC-V source class riscv_asm_program_gen, the brain behind assembly instruction generator
By Mr. Shailesh Vasekar (Senior Consultant at VeriFast Technologies)
Transition Fixes in 3nm Multi-Voltage SoC Design
Rahul Parmar and Mayursinh Vansadiya
eInfochips, Inc.
Breaking the Memory Bandwidth Boundary. GDDR7 IP Design Challenges & Solutions
Innosilicon Technology Ltd
Nine Compelling Reasons Why Menta eFPGA Is Essential for Achieving True Crypto Agility in Your ASIC or SoC
Menta
Menta
How to design secure SoCs, Part III: Secure Boot
Kivicore
KiviCore
Automating NoC Design to Tackle Rising SoC Complexity
Andy Nightingale
Arteris IP
One Platform, Five Libraries: Certus Semiconductor's I/O IP Portfolio for Every Application on TSMC 22nm ULL/ULP Technologies
Certus Semiconductor
Fault Management and Design-for-Test Strategies in Network Chip Architectures
Choosing the Right RFIC Design Partner
AsicNorth
asicNorth
Boosting RISC-V SoC performance for AI and ML applications
Andy Nightingale
Arteris IP
MIPI in FPGAs for mobile-influenced devices
Enabling the next generation of smart glasses
GlobalFoundries
16,000 IP Cores
from 450 Vendors
Provider List
Asic Technology
Select your target foundry and technology
TSMC
Samsung
GlobalFoundries
SMIC
CSMC
HHGrace
Intel
Silterra
STMicroelectronics
Tower
UMC
VIS
X-FAB
Refine
Today on Design And Reuse
VeriSilicon Expands DSP Portfolio with Silicon-Proven ZSP5000 Vision Core Series for Edge Intelligence
- June 26, 2025
China to have 30% of foundry capacity by 2030
- June 26, 2025
eMemory's NeoFuse OTP Qualifies on TSMC's N3P Process, Enabling Secure Memory for Advanced AI and HPC Chips
- June 26, 2025
Semiconductor foundry landscape to transform by 2030
- June 25, 2025
Cadence appoints CFO
- June 25, 2025
Xiphera and Austin Electric Partner to Strengthen Hardware-Based Security in South Korea
- June 25, 2025
D&R Events
IP-SoC China 25
- September 11
th
, 2025
Submission Open >>
IP-SoC South Korea 25
- September 16
th
, 2025
Submission Open >>
IP-SoC Silicon Valley 25
- April 24
th
, 2025
Still Open ! Watch Now >>
IP SoC EU 24
- December 10
th
-11
th
, 2024
Still Open ! Watch Now >>
All News >>
Design IP
VeriSilicon Expands DSP Portfolio with Silicon-Proven ZSP5000 Vision Core Series for Edge Intelligence
- June 26, 2025
eMemory's NeoFuse OTP Qualifies on TSMC's N3P Process, Enabling Secure Memory for Advanced AI and HPC Chips
- June 26, 2025
Sofics Delivers Remarkable PPA & R Performance Near Physical Limits on TSMC 2nm Technology
- June 25, 2025
All News >>
Foundry
China to have 30% of foundry capacity by 2030
- June 26, 2025
Semiconductor foundry landscape to transform by 2030
- June 25, 2025
Samsung Reportedly Prioritizes 2nm/4nm Improvements, with 1.4nm Unlikely Before 2028-29
- June 25, 2025
All News >>
Business
Cadence appoints CFO
- June 25, 2025
Maven Silicon is now an Approved Training Partner of Alteras Solution Acceleration Partner (ASAP) Program!
- June 25, 2025
Nordic Semiconductor acquires Memfault, launches the first complete chip-to-cloud platform for lifecycle management of connected products
- June 25, 2025
All News >>
Security
Xiphera and Austin Electric Partner to Strengthen Hardware-Based Security in South Korea
- June 25, 2025
BT Group Joins the CHERI Alliance to Advance Cybersecurity Innovation
- June 19, 2025
CEA-Leti and Soitec Announce Strategic Partnership to Leverage FD-SOI for Enhanced Security of Integrated Circuits
- June 19, 2025
All News >>
Artificial Intelligence
BrainChip and HaiLa Partner to Demonstrate Ultra-Low Power Edge AI Connectivity for IoT Sensor Applications
- June 25, 2025
3 Trending Sessions Led by Veriest at DAC 2025
- June 22, 2025
Risks of Lack of Strategy for AI in Supply Chains
- June 13, 2025
All News >>
Design Platform
Siemens streamlines design and analysis of complex, heterogeneously integrated 3D ICs
- June 25, 2025
Mirabilis Design Signs OEM Agreement with Cadence to Deliver VisualSim for System-Level Modeling and Performance Optimization
- June 23, 2025
Siemens turbocharges semiconductor and PCB design portfolio with generative and agentic AI
- June 23, 2025
All News >>
Chiplet / Multi-Die
New EDA tools arrive for chiplet integration, package verification
- June 24, 2025
2.5D/3D chip technology to advance semiconductor packaging
- June 23, 2025
The Chiplet Economy: Three Pillars for Semiconductor Success
- June 20, 2025
All News >>
Automotive
Continental to Create an Advanced Electronics & Semiconductor Solutions Organization
- June 23, 2025
Why Standardized SerDes Interfaces Are Essential for In-Vehicle Networks
- June 17, 2025
All News >>
Embedded Processing
Launch of BrainChip Developer Hub Accelerates Event-Based AI Innovation on Akida™ Platform with Release of MetaTF 2.13
- June 22, 2025
All News >>
Green Electronics
Sustainable semiconductor manufacturing - too little too late or Europe protectionism?
- June 16, 2025
All News >>
Internet of Things
Nordic Semiconductor to showcase cutting-edge cellular IoT solutions at MWC Shanghai 2025
- June 13, 2025
D&R Events
IP-SoC China 25
- September 11
th
, 2025
Submission Open >>
IP-SoC South Korea 25
- September 16
th
, 2025
Submission Open >>
IP-SoC Silicon Valley 25
- April 24
th
, 2025
Still Open ! Watch Now >>
IP SoC EU 24
- December 10
th
-11
th
, 2024
Still Open ! Watch Now >>
Partner Highlight
Latest News Alerts