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Today on Design And Reuse
T2M-IP Brings Greater Design Freedom to Semiconductor IP with WhiteBox Licensing
- October 12, 2026
GlobalFoundries marks Dresden expansion milestone, announces next-generation platform for Physical AI
- October 12, 2026
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- October 12, 2026
GF unveils roadmap to deliver the world’s most advanced FD-SOI platform for Physical AI
- October 12, 2026
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- September 10
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- April 23
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Business
GlobalFoundries marks Dresden expansion milestone, announces next-generation platform for Physical AI
- October 12, 2026
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Foundry
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- October 12, 2026
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- October 12, 2026
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Chiplet / Multi-Die
Chiplets at the Edge: How Modular SoCs Redefine Performance Per Watt
- October 12, 2026
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Artificial Intelligence
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- October 12, 2026
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Security
Lattice Semiconductor partners with Arm on AI server security
- October 12, 2026
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- October 8, 2026
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Design Platform and Service
Vayavya Labs and Tenstorrent Partner to Accelerate RISC-V Hardware and Software Development Through Virtual Platform Modeling
- October 8, 2026
Synopsys Expands Agentic AI Across Semiconductor Design With AgentEngineer and Autopilot
- October 5, 2026
OpenAI and Synopsys Announce GPT-Synopsys: Frontier Intelligence to Revolutionize Chip Design
- October 1, 2026
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Automotive
ZLG Selects CAST CAN XL and TSN IP for Next-Generation Vehicle-Network Development and Test Tools
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- October 6, 2026
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Networking
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Design IP
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RISC-V
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- October 1, 2026
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- October 1, 2026
T2M Advances RISC-V CPU IP Cores Portfolio for Next-Generation AI and Intelligent Edge SoCs
- September 28, 2026
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Green Electronics
EU proposes common rating scheme to drive data centre sustainability
- September 28, 2026
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Siemens recognized as a Leader in Gartner Magic Quadrant for Global Industrial AIoT Platforms
- September 24, 2026
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Processor
Cadence Tensilica IP Powers Analog Devices’ Next-Generation DSP Architecture
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D&R Events
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- December 8
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- September 15
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- September 10
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- April 23
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, 2026
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